ACF Bonding is one of the latest techniques that are used by almost all high level electronics manufacturing and fabrication processes. The popularity of the process is mainly due to the fact that the process offers excellent joining capabilities while fulfilling an important requirement of micro electronics fabrication.
The process allows conductive bonds to be formed between the components and the motherboard. This is a very important aspect of the process because conductive bonds are an essential requirement of the micro electronics manufacturing processes.
The process of ACF Bonding is based on the application of a very thin film that acts as the holding and attachments support for the components. This film is often less than 30 micron. This is very appropriate for micro components that are often just a few times bigger than this bond. The fact that the film used in the process allows electrical conductivity of very small voltages and currents is the basis why almost all modern fabrication of electronics employs these technique at the most basic levels.
Modern ACF Bonding equipment is considered state of the art by many specialists. The capabilities offered by current machines are sufficient for the current technology levels. However as component sizes shrink and the product specifications cram in more parts in the given surface area, the need for more specialized process delivery equipment will be felt.
The latest challenges in ACF Bonding are increased surface areas and multi level chip settings. These two areas offer exciting challenges to the process designers and require solutions that could mean drastic changes in the process of as we know and apply it today. The machines used in process are undergoing rapid changes in design and capabilities. In many cases, the process options available at the current setup would be classified as primitive technology in the coming decade.
